Mount | Surface Mount |
---|---|
Max Supply Voltage | 3.45V |
Height Seated (Max) | 2.5mm |
Package / Case | 260-BBGA |
Technology | CMOS |
Address Bus Width | 26 |
Core Architecture | Blackfin |
Terminal Form | BALL |
Number of Pins | 260 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Operating Temperature | -40°C~85°C TA |
Bit Size | 32 |
Mounting Type | Surface Mount |
Power Supplies | 1.53.3V |
Pin Count | 260 |
Memory Size | 308kB |
Packaging | Tray |
Terminal Pitch | 1mm |
Reach Compliance Code | not_compliant |
Non-Volatile Memory | External |
Min Supply Voltage | 950mV |
Terminal Finish | Tin/Lead/Silver (Sn/Pb/Ag) |
Terminal Position | BOTTOM |
Number of Terminations | 260 |
Supply Voltage | 1.5V |
ECCN Code | 3A991.A.2 |
Lead Free | Contains Lead |
Qualification Status | Not Qualified |
Pbfree Code | no |
RoHS Status | Non-RoHS Compliant |
Data Bus Width | 32b |
RAM Size | 32kB |
Low Power Mode | YES |
Boundary Scan | YES |
Number of I/O | 16 |
Barrel Shifter | YES |
JESD-609 Code | e0 |
Number of Timers/Counters | 4 |
Time@Peak Reflow Temperature-Max (s) | 30 |
Peak Reflow Temperature (Cel) | 225 |
Series | Blackfin® |
Internal Bus Architecture | MULTIPLE |
Type | Fixed Point |
Length | 19mm |
Subcategory | Microprocessors |
Contact Plating | Lead, Tin |
Part Status | Obsolete |
Voltage - Core | 1.50V |
Frequency | 300MHz |
Voltage - I/O | 3.30V |
Interface | PCI, SPI, SSP, UART, USB |
Base Part Number | ADSP-BF535 |