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| Core Processor | ARM® Cortex®-M3 |
|---|---|
| Min Operating Temperature | 0°C |
| Supplier Device Package | 896-FBGA (31x31) |
| Package / Case | 896-BGA |
| Core Architecture | ARM |
| Lead Free | Lead Free |
| RoHS Status | RoHS Compliant |
| Primary Attributes | FPGA - 50K Logic Modules |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Speed | 166MHz |
| Operating Temperature | 0°C~85°C TJ |
| Architecture | MCU, FPGA |
| Flash Size | 256KB |
| RAM Size | 64KB |
| Number of I/O | 377 |
| Peripherals | DDR, PCIe, SERDES |
| Max Operating Temperature | 85°C |
| Series | SmartFusion®2 |
| Packaging | Tray |
| Part Status | Obsolete |
| Frequency | 166MHz |
| Published | 2016 |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Interface | CAN, Ethernet, I2C, SPI, UART, USART, USB |
| Base Part Number | M2S050 |
