Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
---|---|
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
Surface Mount | YES |
Terminal Position | BOTTOM |
Package / Case | 625-BFBGA, FCBGA |
Technology | CMOS |
JESD-30 Code | R-PBGA-B625 |
Terminal Form | BALL |
Number of Terminations | 625 |
Supply Voltage-Max (Vsup) | 0.742V |
Supply Voltage | 0.72V |
RoHS Status | ROHS3 Compliant |
Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Speed | 500MHz, 1.2GHz |
Operating Temperature | -40°C~100°C TJ |
HTS Code | 8542.31.00.01 |
Supply Voltage-Min (Vsup) | 0.698V |
Architecture | MCU, FPGA |
RAM Size | 256KB |
Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
Number of I/O | 180 |
Peripherals | DMA, WDT |
Factory Lead Time | 11 Weeks |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Series | Zynq® UltraScale+™ MPSoC CG |
Packaging | Tray |
Part Status | Active |
Published | 2016 |
Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Xilinx
FPGA Zynq UltraScale+ Family 653100 Cells 20nm Technology 0.85V 1760-Pin FCBGA Tray