Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
---|---|
Storage/Refrigeration Temperature | 32°F ~ 50°F (0°C ~ 10°C) |
Form | Jar, 17.64 oz (500g) |
Process | Lead Free |
Product Status | Active |
Wire Gauge | - |
Flux Type | Water Soluble |
Series | - |
Type | Solder Paste |
Mesh Type | 4 |
Shelf Life Start | Date of Manufacture |
Package | Bulk |
Shelf Life | 6 Months |
Diameter | - |
Melting Point | - |