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Home > Products > Sockets for ICs, Transistors > IC Sockets > 30-823-90C
30-823-90C

30-823-90C

Aries Electronics

CONN IC DIP SOCKET 30POS GOLD

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Products Specifications
Contact Finish - MatingGold
Operating Temperature-55°C ~ 105°C
Contact Material - PostBrass
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish Thickness - Mating30.0µin (0.76µm)
TerminationSolder
Mounting TypeThrough Hole, Right Angle, Horizontal
Product StatusActive
Number of Positions or Pins (Grid)30 (2 x 15)
Pitch - Post0.100" (2.54mm)
Contact Finish Thickness - Post200.0µin (5.08µm)
SeriesVertisockets™ 800
TypeDIP, 0.3" (7.62mm) Row Spacing
Contact Finish - PostTin
Pitch - Mating0.100" (2.54mm)
Contact Material - MatingBeryllium Copper
FeaturesClosed Frame
PackageBulk
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