Contact Finish - Mating | Gold |
---|---|
Operating Temperature | -55°C ~ 125°C |
Contact Material - Post | Brass |
Housing Material | FR4 Epoxy Glass |
Contact Finish Thickness - Mating | 10.0µin (0.25µm) |
Termination | Solder |
Mounting Type | Through Hole |
Product Status | Active |
Number of Positions or Pins (Grid) | 272 (20 x 20) |
Pitch - Post | 0.050" (1.27mm) |
Contact Finish Thickness - Post | 10.0µin (0.25µm) |
Series | 550 |
Type | BGA |
Contact Finish - Post | Gold |
Pitch - Mating | 0.050" (1.27mm) |
Contact Material - Mating | Brass |
Features | Closed Frame |
Package | Bulk |