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| PCB changed | 14 |
|---|---|
| Maximum Propagation Delay Time @ Maximum CL (ns) | 5.2@3.3V|6@2.7V |
| Maximum Quiescent Current (uA) | 10 |
| Number of Elements per Chip | 4 |
| ECCN (US) | EAR99 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Supplier Package | TSSOP-B |
| Maximum High Level Output Current (mA) | -24 |
| Process Technology | CMOS |
| Absolute Propagation Delay Time (ns) | 6 |
| Propagation Delay Test Condition (pF) | 50 |
| Logic Function | NAND |
| Package Height | 1 |
| Number of Element Outputs | 1 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Number of Selection Inputs per Element | 0 |
| RoHS Status | RoHS Compliant |
| Number of Element Inputs | 2-IN |
| Supplier Temperature Grade | Automotive |
| Standard Package Name | SOP |
| Maximum Low Level Output Current (mA) | 24 |
| Pin Count | 14 |
| Mounting | Surface Mount |
| Number of Output Enables per Element | 0 |
| Lead Shape | Gull-wing |
| Packaging | Tape and Reel |
| Part Status | Active |
| Typical Operating Supply Voltage (V) | 2.5|3.3 |
| Logic Family | LCX |
| Package Width | 4.4 |
| Minimum Operating Supply Voltage (V) | 1.65 |
