Contact Finish - Mating | Tin-Lead |
---|---|
Operating Temperature | -55°C ~ 125°C |
Contact Material - Post | Beryllium Copper |
Housing Material | Diallyl Phthalate (DAP) |
Contact Finish Thickness - Mating | 20.0µin (0.51µm) |
Termination | Solder |
Mounting Type | Chassis Mount |
Product Status | Obsolete |
Number of Positions or Pins (Grid) | 3 (Round) |
Pitch - Post | - |
Contact Finish Thickness - Post | 20.0µin (0.51µm) |
Series | - |
Type | Transistor, TO-3 |
Contact Finish - Post | Tin-Lead |
Pitch - Mating | - |
Contact Material - Mating | Beryllium Copper |
Features | Closed Frame |
Package | Bulk |