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| Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
|---|---|
| Storage/Refrigeration Temperature | 32°F ~ 77°F (0°C ~ 25°C) |
| Form | Jar, 8.8 oz (250g) |
| Process | Lead Free |
| Product Status | Active |
| Wire Gauge | - |
| Flux Type | No-Clean, Water Soluble |
| Series | CHIPQUIK® SMD4300 |
| Type | Solder Paste |
| Mesh Type | - |
| Shelf Life Start | Date of Manufacture |
| Package | Bulk |
| Shelf Life | 6 Months |
| Diameter | - |
| Melting Point | 280°F (138°C) |
